High-Density Arrays
High-Density Arrays
Extreme Performance • Open-Pin-Field • Low-Profile
Samtec high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.
Variety of Options
- Pitch: 0.635 mm, 0.80 mm, 1.27 mm
- Pin/Pair Count: 8 to 500; 1,000+ Roadmap
- Stack Height: 4 mm to 40 mm
- Options: Right-angle, press-fit tails, 85 Ω tuned, standoffs
| Brand/Series | Pitch | Stack Height | Pin Count |
|---|---|---|---|
|
NovaRay® NVAM/NVAF |
0.80 mm x 1.80 mm | 7 & 10 mm | 8, 12, 16, 24, 32 pairs |
|
AcceleRate® HP APM6/APF6 |
0.635 mm | 5 & 10 mm | 80, 240, 400 |
|
AcceleRate® HD ADM6/ADF6 |
0.635 mm | 5 mm | 40-400 |
|
SEARAY™ SEAM/SEAF |
1.27 mm x 1.27 mm | 7-18.5 mm | 40-560 |
|
SEARAY™ 0.80 mm SEAM8/SEAF8 |
0.80 mm | 7 & 10 mm | 40-500 |
|
LP Array™ LPAM/LPAF |
1.27 mm x 1.27 mm | 4, 4.5, 5 mm | 40-400 |
NovaRay®NovaRay® 112 Gbps PAM4 Array, Extreme Density Arrays
NovaRay® combines extreme density and performance for this 112 Gbps PAM4 array per channel in 40% less space than traditional arrays.
Features
- 112 Gbps PAM4 per channel
- 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
- Innovative, fully shielded differential pair design enables extremely low crosstalk (to 40 GHz) and tight impedance control
- 112 differential pairs per square inch
- Two points of contact ensure a more reliable connection
- 92 Ω solution addresses both 85 Ω and 100 Ω applications
- Analog Over Array™ capable
AcceleRate® HP High-Performance ArraysAcceleRate® HP High-Performance Arrays
AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design. View the full line of AcceleRate® products.
Features
- 0.635 mm pitch open-pin-field array
- 56 Gbps NRZ/112 Gbps PAM4 performance
- Cost optimized solution
- Low-profile 5 mm and up to 10 mm stack heights
- Up to 400 total pins available; roadmap to 1,000+ pins
- Data rate compatible with PCIe® 5.0 and 100 GbE
- Analog Over Array™ capable
- View the full line of AcceleRate® products
AcceleRate® HDAcceleRate® HD Ultra-Dense, Slim Body Multi Row Mezzanine Strips
These 0.635 mm pitch high-density arrays are multi row mezzanine strips that feature up to 240 high-speed Edge Rate® contacts in a slim, low-profile design. View the full line of AcceleRate® products.
Features
- Incredibly dense with up to 240 total I/Os; up to 400 I/Os in development
- Low profile 5 mm stack height
- Slim 5 mm width
- 4-row design; 10 - 60 positions per row (40 - 240 total positions)
- Edge Rate® contact system optimized for signal integrity performance
- Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
- Solder ball technology for simplified processing and self aligning
- Additional stack heights in development
- View the full line of AcceleRate® products
SEARAY™SEARAY™ High Density Open Pin Field Arrays
These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.
Features
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- 56 Gbps PAM4 performance
- Up to 560 I/Os in open pin field design
- 1.27 mm (.050") pitch
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- Analog Over Array™ capable
- 7 - 18.5 mm stack heights
- Vertical, right-angle, press-fit
- Elevated systems to 40 mm
- 85 ohm systems
- Standards: VITA 47, VITA 57.1 FMC, VITA 57.4 FMC+, VITA 74 VNX, PISMO™ 2
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.
Features
- 0.80 mm (.0315") pitch grid
- 50% board space savings versus .050" (1.27 mm) pitch arrays
- 28 Gbps NRZ/56 Gbps PAM4 performance
- Rugged Edge Rate® contact system
- Up to 500 I/Os
- 7 mm and 10 mm stack heights
- Solder charge terminations for ease of processing
- Samtec 28+ Gbps Solution
- Final Inch® certified for Break Out Region trace routing recommendations
- Analog Over Array™ capable
LP Array™LP Array™ Low Profile Open-Pin-Field High-Density Array
These low profile open-pin-field arrays feature as low as a 4 mm stack height and up to 400 total I/Os.
Features
- 4 mm, 4.5 mm, 5 mm stack heights
- Up to 400 I/Os
- 4, 6 and 8 row designs
- .050" (1.27 mm) pitch
- Dual beam contact system
- Solder crimp termination for ease of processing
- 28 Gbps NRZ/56 Gbps PAM4 performance
- Analog Over Array™ capable
