Connectivity Solutions For Emerging
Artificial Intelligence Architectures
Rapidly-growing technologies like Artificial Intelligence / Machine Learning are driving new system architectures that demand increased speeds, bandwidths, frequencies and densities, along with scalability and configurability. To meet these challenges, Samtec offers innovative connectivity solutions ideal for next generation AI/ML applications – from testing and development, to high-performance interconnects, along with full system optimization support.
NEXT GEN SYSTEM
EXPERTISE
HIGH-PERFORMANCE
INTERCONNECTS
FULL SYSTEM SUPPORT
CHIPSETS
Computing Platforms Characterization Kits & Boards Reference Designs
EMBEDDED PLATFORMS
System on Modules (SoMs) Computer on Modules (CoMs) Carrier Cards
ACCELERATORS
GPU/CPU Modules Vision Systems Array Servers
APPLICATION SPECIFIC
Ultra-low Latency, High Data Rates, High-Density, Low Ping Solutions
Interconnect Solutions
Samtec offers a broad line of cost-effective, high pin count, extreme performance / density, and high mating cycle interconnect solutions, ideal for a wide range of high-performance test platforms.
High-Speed Mezz& High-Density Arrays
High-Performance Test& Precision RF
Ultra Micro /High Power
High-PerformanceCable Systems
As bandwidth, scale and power requirements continue to challenge conventional engineering methods, Samtec leverages industry-leading expertise to help optimize the entire high-performance system, offering innovative online design tools, an extensive library of characterization and development kits, along with engineering and testing support to help streamline the development process. Contact sig@samtec.com to discuss your application.
Industry LeadingSignal Integrity Expertise
Characterization &Development Boards
Online Design &Development Tools
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